TSMC announced that the 4nm process will be trial-produced in the third quarter, and the 3nm will be mass-produced in the second half of next year

IT House June 2 News According to Taiwan Economic Daily, the leading wafer foundry TSMC held the 2021 Technology Forum today and announced that the 4nm process technology is expected to start trial production in the third quarter of 2021, one quarter earlier than the previous plan. , and the 3nm process will be mass-produced in the second half of 2022 as planned.

This year is the second year in a row that TSMC has held a technical forum in an online format to share with customers the latest technological developments of TSMC, including the N6RF process that supports next-generation 5G smartphones and WiFi 6/6e performance, and the N6RF process that supports the most advanced automotive applications. N5A process, and an enhanced version of the 3DFabric family of technologies.

TSMC revealed the latest innovations in advanced logic technology, special technology, and 3DFabric advanced packaging and chip stacking technology at this technical forum. This year, more than 5,000 customers and technology partners from all over the world registered to participate June 1 Online technical forum to be held on the 2nd.

At this year’s technology forum, TSMC introduced the N5 (5nm), N4 (4nm), N5A (5nm A), and N3 (3nm) process technologies. TSMC pointed out that since 2020, leading the industry in mass production of 5nm technology, its yield rate will increase faster than the previous generation of 7nm technology. The N4-enhanced version in the N5 family further improves performance, power efficiency, and transistor density by reducing mask layers and using design principles that are nearly compatible with N5.

TSMC pointed out that since its announcement at the TSMC Technology Forum in 2020, the development of N4 has progressed quite smoothly, and trial production is expected to begin in the third quarter of 2021.

TSMC also introduced the latest member of the 5nm family, the N5A process, aimed at meeting the increasing demands for computing power in newer and more enhanced automotive applications, such as AI-enabled driver assistance and digital vehicle cockpits.

TSMC said that the N5A brings the same technology used in today’s supercomputers into vehicles, carrying the computing performance, power efficiency, and logic density of the N5, while meeting the stringent quality and reliability requirements of AEC-Q100 Grade 2, as well as other automotive Standards of safety and quality.

IT House has learned that TSMC’s N3 technology is scheduled to become the world’s most advanced logic technology when mass production begins in the second half of 2022. N3 supports optimal performance, power efficiency, and cost-effectiveness with a reliable FinFET transistor architecture that delivers up to 15% faster speed, 30% lower power consumption, and 70% higher logic density than N5 technology .

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